MediaTek has announced its inaugural chipset in the new Dimensity 7000 series, the Dimensity 7200. This new chipset boasts cutting-edge AI image features, and significant optimizations for gaming and 5G, all while improving energy efficiency for prolonged battery life.
One of the key features of the Dimensity 7200 is its second-generation 4nm (nanometer) process from Taiwan Semiconductor Manufacturing Company (TSMC), which is ideal for ultra-thin designs in a variety of smartphone form-factors.
The octa-core CPU integrates two Arm Cortex-A715 cores with operating speeds of up to 2.8 GHz, along with six Cortex-A510 cores, allowing users to multitask fluidly and enjoy maximum performance on every app.
To further optimize energy and performance, the integrated MediaTek AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI fusion processing.
“The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts looking for an affordable way to get the most out of their phone’s battery life without compromising performance,” said CH Chen, Vice General Manager of Wireless Communications Business at MediaTek.
For gamers, the MediaTek HyperEngine 5.0 technology offers AI-based variable rate shading with the help of Variable Rate Shading (VRS). The VRS feature optimizes CPU and GPU resources for better battery life and other updates for smooth gameplay.
The chipset also integrates a powerful Arm Mali G610 GPU that supports quick response times and maintains high frame rates. Using MediaTek’s Imagiq 765 and a 14-bit HDR Image Signal Processor (ISP), the Dimensity 7200 supports 200 MP primary cameras for high-quality photos.
The chipset allows for HDR 4K video capture and even allows users to capture content from two cameras simultaneously with Full HD resolution while keeping everything in focus with autofocus technology. To ensure users can capture sharp images at night and in low-light environments, the chipset features integrated motion compensated noise reduction. Additionally, the APU supports powerful real-time AI camera enhancements, such as real-time portrait beautification.
The Dimensity 7200 features a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink and supports triband Wi-Fi 6E connectivity and Bluetooth 5.3. The fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite ensure power consumption efficiency.
For reliable coverage everywhere, the chipset supports Carrier Aggregation 2CC (the capacity to use two frequencies simultaneously) and Dual 5G SIM with dual VoNR (Voice over New Radio), which allows for voice calls over the 5G data network with greater transmission capacity and better voice quality.
The Dimensity 7200 will be available for 5G devices launching globally in the first quarter of 2023.